Probe card and method for manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
Jul 3, 2003
app pub date -
Oct 29, 2002
filing date -
Dec 31, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention discloses a probe card, which includes one substrate and one conductive layer with a circuit pattern on the conductive layer. The probe card is characterized in that a gap is located between the circuits of the circuit pattern. The gap has a predetermined depth from the surface level of the substrate to isolate the circuits by the air to increase the resistance of the probe card and reduce the parasitic capacitance so as to improve the precision of the measurement. Since the gaps between the circuit patterns are formed by an engraving process, the leakage current effect due to a fault etching in prior art is avoided thereof.
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