Mechanically glued board of wood material
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
Jul 10, 2003
app pub date -
Nov 1, 2002
filing date -
Aug 16, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The invention relates to a method of manufacture as well as associated apparatus for a board made of fibres or chip as well as a board made by the method. The invention relates in particular to MDF- or HDF- or chip boards. The aim of the invention is the provision of a board with a smaller proportion of glue in comparison with the state of the art. To solve the problem of the invention the fibres or chips are in particular first dried and then glue is mixed with the dried fibres or chips at temperatures lying substantially below the drying temperatures and in fact in particular below 100.degree. C. In this way one avoids the glue being undesirably exposed to the relatively high temperatures which arise during the drying. The result is a board having a relatively low proportion of glue.
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