Metal polishing slurry having a static etch inhibitor and method of formulation
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United States of America Patent
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Issued Date -
Jul 24, 2003
app pub date -
Jan 24, 2002
filing date -
Jan 24, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A metal polishing slurry having a static etch inhibitor and method for polishing a substrate while inhibiting static etching during the polishing of a substrate. The slurry composition includes an iodate-free halogenated inhibiting compound added to a generic slurry to form a resultant slurry. The substrate is polished using the resultant slurry, which inhibits the static etching of the substrate being polished. Also provided is a metal polishing slurry for inhibiting static etch comprising an oxidizer, a complexing agent, and an iodate-free halogenated inhibiting compound.
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