Radiation-curable compositions and related methods for the assembly and repair of optical components and products prepared thereby
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United States of America Patent
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Issued Date -
Jul 24, 2003
app pub date -
Oct 31, 2002
filing date -
Oct 31, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Improved radiation-curable compositions and related methods useful in the assembly of optical components. These compositions cure via free-radical polymerization and comprise: about 30 to about 70 wt. % oligomer; about 10 to about 50 wt. % reactive diluent; and about 0.1 to about 40 wt. % adhesion promoter, wherein the cured composition exhibits a modulus of less than about 50 MPa, and a dry adhesion in excess of about 50 g force. A related aspect of the present invention is a higher modulus composition that cures via free-radical polymerization and comprises: about 30 to about 70 wt. % oligomer; about 10 to about 50 wt. % reactive diluent; and about 0.1 to about 40 wt. % polymerizable adhesion promoter, wherein the cured composition exhibits a modulus of greater than about 600 MPa.
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