Method for determining optimum bonding parameters for bonding with a wire bonder
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United States of America Patent
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Aug 16, 2005
Grant Date -
Aug 7, 2003
app pub date -
Feb 3, 2003
filing date -
Feb 1, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for finding optimum bond parameters for a bond force FB and an ultrasonic variable P and, optionally, at least one further bond parameter of a wire bonder uses a sensor sensitive to a shear force exerted by the capillary on a connection point. A predetermined number of bonding operations with varying bonding parameters is performed. Optimum bond parameters are derived from the signal of the sensor.
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