Chassis arrangement for reducing flame emissions
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
Aug 7, 2003
app pub date -
Feb 7, 2002
filing date -
Feb 7, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A chassis arrangement that minimizes lateral flame spread from card to card within the chassis, and increases heat dissipation from the chassis, comprising a heat sink attached to the inside of the chassis cover to dissipate excess heat from within the chassis, and PCB shields disposed between the circuit cards of the chassis and acting in concert with the heat sink to act as physical and thermal barriers to prevent lateral flame spread from card to card due to flame and hot gas wrap-around.
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