Encapsulation by coating with a mixture of lipids and hydrophobic, high melting point compounds
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United States of America Patent
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N/A
Issued Date -
Aug 7, 2003
app pub date -
Jan 8, 2003
filing date -
Jan 8, 2002
priority date (Note) -
Abandoned
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Abstract
An encapsulated ingredient is disclosed comprising an ingredient component and a coating component. The coating component includes a lipid and one or more hydrophobic, high melting point compounds. The coating component typically has a melting point of at least about 70.degree. C.
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