Wafer interposer assembly
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United States of America Patent
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Aug 23, 2005
Issued Date -
N/A
app pub date -
Feb 24, 2003
filing date -
Dec 15, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A wafer interposer assembly and a system for building the same are disclosed. The wafer interposer assembly includes a semiconductor wafer (10) having a die (11) and a redistribution layer pad (13) electrically connected to the die (11). An epoxy layer (20) is deposited on the surface of the redistribution layer pad (13) and the die (11). An interposer pad (50) is positioned in an opening (40) in the epoxy layer (20) in electrical contact with the redistribution layer pad (13).
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