Intelligent integrated circuit wafer handling system with fail safe system

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United States of America Patent

SERIAL NO

10336352

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A system for handling stiff but flexible discs, particularly semiconductor wafers, includes a fail safe mechanism that prevents the disc from being dropped if power to the unit is interrupted. A wafer grasping assembly member includes and one or more fingers or posts oriented, or which may be oriented, to a position perpendicular to the plane of the stiff hand assembly member. An electric powered drive system controls the lateral movement of at least one finger or post to cause the wafer to be grasped with controlled traction force between the fixed and moveable posts or fingers. The traction force is controlled by the amount of electrical current fed to the translator solenoid. If the power to the electric powered drive system is interrupted, springs in the system cause the disk to be held between the fixed posts and moveable post or finger until power is restored.

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Patent Owner(s)

Patent OwnerAddress
HOLBROOKS ORVILLE RAYNot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Holbrooks, Orville Ray Santa Fe, NM 4 91

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