Process for fabricating an ADSL relay array
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United States of America Patent
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Issued Date -
Aug 14, 2003
app pub date -
Jan 13, 2003
filing date -
Jan 23, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of fabricating electro-magnetic relays and arrays of relays using existing and adapted PCB fabrication techniques, in which the activation coils are incorporated into the layers of a multi-layer PCB and the magnetic circuit of the relay is formed partly on the surface of the PCB using, eg, electroplating techniques, and partly in one or more through-holes using plated through holes, the plated through hole plating being extended to form a support for the movable relay contact which is formed on a removable release layer.
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