Multiple degree of freedom substrate manipulator
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United States of America Patent
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Jun 29, 2004
Grant Date -
Aug 21, 2003
app pub date -
Feb 15, 2002
filing date -
Feb 15, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A system for manipulating a planar substrate such as a semiconductor wafer is provided. The manipulator is typically used in conjunction with an XY stage to focus and planarize a wafer with respect to a tool. The manipulator employs redundant actuators of different types and a control system that uses low-bandwidth, high efficiency actuators to provide low frequency forces and high-bandwidth, but less efficient, actuators to provide all other forces. The manipulator provides support and manipulation of a substrate while minimizing errors due to thermal distortion.
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