Multi-layer wiring device, wiring method and wiring characteristic analyzing/predicting method
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United States of America Patent
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N/A
Issued Date -
Aug 28, 2003
app pub date -
Feb 24, 2003
filing date -
Feb 22, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A multi-layer wiring device includes a plurality of wiring layers which each have a plurality of wirings pitch-arranged in the same direction and are laminated on one another to make pitch-arrangement directions of the wirings of adjacent ones of the wiring layers cross each other. The device further includes a plurality of contact portions which connect the plurality of wirings to each other are provided to permit first and second potentials which are different from each other to be supplied to adjacent ones of the wirings of the plurality of wiring layers.
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