Apparatus for flip-chip packaging providing testing capability
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United States of America Patent
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Mar 29, 2011
Grant Date -
Sep 4, 2003
app pub date -
May 17, 2002
filing date -
Mar 4, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and apparatus for increasing the integrated circuit density in a flip-chip semiconductor device assembly including an interposer substrate facilitating use with various semiconductor die conductive bump arrangements. The interposer substrate includes a plurality of recesses formed in at least one of a first surface and a second surface thereof, wherein the recesses are arranged in a plurality of recess patterns. The interposer substrate also provides enhanced accessibility for test probes for electrical testing of the resulting flip-chip semiconductor device assembly.
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