High resolution hidden damage imaging
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United States of America Patent
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Issued Date -
Sep 4, 2003
app pub date -
Jan 15, 2003
filing date -
Mar 19, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
This invention relates to apparatus for the nondestructive measurements of materials. New eddy current sensing arrays and methods are described which provide a capability for high resolution imaging of test materials and also a high probabilitity of detection for defects and flaws around features such as fasteners. The arrays incorporate unique layouts for the sensing elements, generally have essentially identical sensor arrays with sensing elements aligned in proximity to the drive elements, and conductive pathways that promote cancellation of undesired magnetic flux. These features enable the use of small sense elements that permits high resolution imaging of material properties.
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