Thermosetting resin composition
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United States of America Patent
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N/A
Issued Date -
Sep 18, 2003
app pub date -
Dec 27, 2002
filing date -
May 31, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The purpose of the present invention provides a thermosetting resin composition suitable for use in sealing or encapsulating semiconductor devices, which resin composition is improved in impact strength, resistance in thermal cracking test, resistance to deterioration caused by heat or by oxidation, without lowering thermal stability represented by HDT, wherein the composition containing a thermosetting resin, an epoxy group-containing liquid polybutene and, if necessary, a curing agent, and said epoxy group-containing liquid polybutene has epoxy structures substantially at the terminal ends of molecules and 80 molar % or more of repeating units in the main chain structure has a specific structure. Furthermore, the cured thermosetting resin composition has a phase structure, in which dispersed phases of several .mu.m in diameter and being mainly composed of epoxy group-containing liquid polybutene, are dispersed in a continuous phase that is mainly composed of said thermosetting resin.
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