Method of cleaning a semiconductor processing chamber
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United States of America Patent
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Jan 18, 2005
Grant Date -
Oct 2, 2003
app pub date -
Apr 2, 2002
filing date -
Apr 2, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of operating a substrate processing chamber. In one embodiment the method includes processing one or more substrates in the substrate processing chamber and subsequently cleaning the chamber using a dry cleaning process. This substrate processing and dry cleaning sequence is then repeated multiple times before chamber is further cleaned by flowing a cleaning gas into the chamber and forming a plasma within the chamber from the cleaning gas in an extended cleaning process. During the extended cleaning process the plasma is maintained within the chamber for a total of at least 5 minutes before the chamber is reused to process a substrate.
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