Optimized heat sink using high thermal conducting base and low thermal conducting fins
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United States of America Patent
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Issued Date -
Oct 2, 2003
app pub date -
Mar 29, 2002
filing date -
Mar 29, 2002
priority date (Note) -
Abandoned
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Abstract
An optimized design for a composite heat sink is provided utilizing a high thermal conducting base and low thermal conducting fins. The base preferably is constructed from anisotropic graphite material, and the fins are preferably constructed from a thermally conductive plastic material. In the case of a low profile heat sink having a fin height of no greater than about 15 mm, the composite construction provides superior cooling yet lighter weight as compared to a conventional all-aluminum heat sink of the same dimensions.
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