Method and apparatus for stacking multiple die in a flip chip semiconductor package
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United States of America Patent
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N/A
Issued Date -
Oct 2, 2003
app pub date -
Mar 29, 2002
filing date -
Mar 29, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor package is disclosed where the package includes a first die mounted to first surface of a second die. The first surface of the second die is then mounted to a substrate. The substrate includes a hole of appropriate size to receive the first die and to allow the second die to be mounted to the substrate using conventional interconnection and assembly techniques.
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