Electrically isolated power device package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 2, 2003
app pub date -
Mar 19, 2003
filing date -
May 4, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A packaged power device includes a substrate including a first conductive layer, a second dielectric layer, and a third conductive layer. The first conductive layer is bonded to the second dielectric layer, and the second dielectric layer is bonded to the third conductive layer. The first and third conductive layers are electrically isolated from each other. The substrate has a lower surface. A semiconductor die is bonded to the first conductive layer of the substrate. A plastic package encloses the die and has a lower surface. A curved backside includes the lower surfaces of the plastic package and substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully