Processing substrate and/or support surface and method of producing same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Feb 11, 2003
filing date -
Oct 2, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A processing substrate includes an absorbent material layer and randomly spaced strands of thermoplastic material disposed on a side of the absorbent material layer forming a cut resistant and liquid pervious surface. The method of producing the processing substrate includes providing an absorbent material layer, moving the absorbent material layer, and depositing randomly spaced strands of material onto a side of the absorbent material layer to form a cut resistant and liquid pervious surface.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully