Importance

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Abstract

Techniques for controlling an output property during wafer processing include forwarding feedforward and feedback information between functional units in a wafer manufacturing facility. At least some embodiments of the invention envision implementing such techniques in a copper wiring module to optimize a sheet resistance or an interconnect line resistance. Initially, a first wafer property is measured during or after processing by a plating process. Subsequently, the wafer is forwarded to a polishing process. A second wafer property is then measured during or after processing by the second process. At least one of these first and second wafer properties are used to optimize the second process. Specifically, one or more target parameters of a second process recipe are adjusted in a manner that obtains a desired final output property on the wafer by using these first and second wafer properties. Examples of the wafer properties that may be measured at the first process include thickness profile, edge exclusion information, sheet resistance profile, reflectance, resistivity drop, and reflectivity. Examples of the wafer properties that may be measured at the second process include copper clearing time, reflectance, thickness, and an electrical property.

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First Claim