Method and system for cleaning a wafer chuck

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20030200996A1
SERIAL NO

10135119

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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The present invention relates to a method of cleaning a wafer chuck (10) by an automated system that supplies a solvent to a chuck surface (12), washes the chuck surface (12), and dries the chuck surface (12) by spinning the chuck (10), in one embodiment. In another embodiment, the chuck surface (12) is dried by pulling a vacuum on the chuck surface (12) or flowing a gas on the chuck surface (12). Additionally, a brush can be used to wash the chuck surface (12).

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Patent Owner(s)

Patent OwnerAddress
MOTOROLA INC1303 EAST ALGONQUIN ROAD SCHAUMBURG IL 60196 U S A

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hiatt, William Mark Eagle, ID 20 440
Mautz, Karl E Round Rock, TX 12 233

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