Waterborne printed circuit board coating compositions
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United States of America Patent
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N/A
Issued Date -
Nov 27, 2003
app pub date -
Mar 24, 2003
filing date -
Apr 11, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention provides waterborne printed circuit board coating compositions having surfactants that can bind into the polymeric network that is formed upon curing the printed circuit board coating compositions. In one embodiment, the present invention provides waterborne printed circuit board compositions having one or more of the following components (1)-(3): (1) a thermosetting component comprising one or more thermosetting groups; and a surfactant; (2) a photoreactive polymer comprising at least two ethylenically unsaturated groups; and a surfactant; (3) a surfactant comprising one or more epoxy-reactive groups, e.g. one or more carboxylic acid groups.
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