Vented circuit board for cooling power components
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United States of America Patent
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-
Dec 20, 2005
Grant Date -
Dec 11, 2003
app pub date -
Jun 10, 2003
filing date -
Jun 10, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention provides a circuit board including a first conductor layer forming a plurality of conductive circuit traces for interconnecting electronic components. The circuit board includes a substrate for supporting the first conductor layer and a pedestal formed from the substrate for supporting at least one of the plurality of electronic components. The pedestal provides a heat conduction path for conducting heat away from the at least one of the plurality of electronic components and a aperture in the substrate adjacent the pedestal for allowing a fluid to pass through the substrate.
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