Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture
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United States of America Patent
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N/A
Issued Date -
Dec 11, 2003
app pub date -
May 20, 2003
filing date -
May 23, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Disclosed is a circuit element including a substrate, a coating disposed on the substrate, and a conductive trace adjacent to the coating. The coating includes both pigment and hydrophobic binder. Also disclosed is a method for forming a circuit element. The method includes the steps of providing a substrate, disposing a coating that includes both a pigment and a hydrophobic binder on the substrate, and printing a conductive trace on the coating.
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Cited Art Landscape
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