Method for fabricating fiber blocks using solder as bonding material
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United States of America Patent
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Issued Date -
Dec 25, 2003
app pub date -
Oct 31, 2002
filing date -
Jun 22, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention provides a method for fabricating an optical fiber block capable of preventing degradations due to an outgassing effect provided from an epoxy material. The inventive method includes the steps of: forming an adhesion layer and a solder on predetermined regions of a first substrate where a predetermined plurality of grooves are formed; arranging a number of optical fibers in the plurality of grooves; covering a second substrate to the first substrate; soldering the solder to bond the first and the second substrates together; and simultaneously fixing the optical fibers within the V-grooves.
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