Method of determining nitrogen concentration within a wafer

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United States of America Patent

PATENT NO 6896727
APP PUB NO 20040000267A1
SERIAL NO

10184666

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An improved method of determining the concentration of nitrogen within a wafer is provided. At least a portion of the nitrogen within the wafer is initially gettered to a gettering site. In order prevent the in-diffusion of nitrogen, a barrier layer is generally deposited upon the wafer prior to gettering the nitrogen within the wafer. The nitrogen is then measured at the gettering site. The concentration of nitrogen within the wafer is then determined based upon the measurement of nitrogen at the gettering site and the diffusion coefficient for nitrogen. In this regard, the diffusion coefficient of nitrogen permits the measurement of nitrogen at the gettering site to be translated into a measurement of the concentration of nitrogen throughout the entire wafer.

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Patent Owner(s)

  • SEH AMERICA, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Koveshnikov, Sergei V Vancouver, WA 19 103

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