System and method for improved transducer thermal design using thermo-electric cooling
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United States of America Patent
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N/A
Issued Date -
Jan 1, 2004
app pub date -
Jun 27, 2002
filing date -
Jun 27, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An ultrasound transducer assembly having a housing, a transducer array mounted in the housing, and active cooling mechanism positioned adjacent to the transducer array for actively removing heat generated by the array by transport of heat energy from the affected site. The active cooling mechanism comprises a thermo-electric cooler which utilizes active thermal transport to remove heat from the transducer. The thermoelectric cooler may be used alone or in combination with a phase change material or other system to subsequently remove the heat from the thermo-electric cooler. The thermo-electric cooler is coupled with the flex-circuit layers of the transducer to efficiently remove heat generated within the component layers of the transducer.
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