Titanium copper alloy having excellent strength and bendability, and manufacturing method thereof
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United States of America Patent
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Issued Date -
Jan 8, 2004
app pub date -
Jun 19, 2003
filing date -
Jun 21, 2002
priority date (Note) -
Abandoned
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Abstract
A titanium copper alloy having excellent strength and bendability comprising 1.0 to 4.5% by mass of Ti, the balance of copper and inevitable impurities, characterized in that; diameters of the intermetallic compound particles consisting of Cu and Ti precipitated in the alloy are 3 .mu.m or less; the average number of the intermetallic compound particles having the diameters of 0.2 to 3 .mu.m is 700 or less per a cross-sectional area of 1000 .mu.m.sup.2 in a transverse direction to a rolling direction; the average grain size measured in the above cross-sectional area is 10 .mu.m or less; and a tensile strength is 890 MPa or more.
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