Apparatus and method for application of adhesive substances to objects

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United States of America Patent

SERIAL NO

10189883

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention provides an apparatus and method for the application of adhesive substances to objects, such as solder balls, for the purpose of mounting them onto substrates. The apparatus comprises an applicator having a layer of the adhesive substance and a pick carrier to carry objects and move the objects from a supply source to a substrate for mounting the objects thereon. The applicator is located so that the applicator applies the adhesive substance to the objects while the objects carried on the pick carrier are moving between the supply source and the substrate.

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Patent Owner(s)

Patent OwnerAddress
ASM ASSEMBLY AUTOMATION LTD20 \/ F WATSONS CENTRE 16-22 INDUSTRIAL STREET KWAI CHUNG NEW TERRITORIES HONGKONG HONG KONG HONG KONG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, See Lok Hong Kong, CN 3 13
Cheng, Chi Wah Honk Kong, CN 59 295
Chong, Ping Chun(Benson) Hong Kong, CN 1 6
Hung, Kin Yik Hong Kong, CN 8 60

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