Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures
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United States of America Patent
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Jul 31, 2007
Grant Date -
Jan 8, 2004
app pub date -
May 7, 2003
filing date -
May 7, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are form from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurs during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.
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