Three dimensional integrated circuits
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United States of America Patent
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N/A
Issued Date -
Jan 8, 2004
app pub date -
Oct 8, 2002
filing date -
Jul 8, 2002
priority date (Note) -
Abandoned
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Abstract
A three-dimensional semiconductor device includes a first module layer having a plurality of circuit blocks; and a second module layer positioned substantially above the first module layer, including a plurality of configuration circuits to control a portion of the circuit blocks.
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