Method of providing a metallic contact on a silicon solar cell
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United States of America Patent
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Issued Date -
Jan 8, 2004
app pub date -
Jul 3, 2002
filing date -
Jul 3, 2002
priority date (Note) -
Abandoned
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Abstract
An improved process for producing a more uniform deposition of the nickel on the surface of a silicon solar cell comprising the steps of immersing the silicon solar cell into an activator solution comprising gold and a fluoride salt, and subsequently immersing the solar cell into an electroless nickel plating solution. The process provides an improved deposition of nickel on the silicon solar cell, and produces a more uniform deposition of nickel as compared to the prior art. Subsequent to the nickel deposition step, the solar cell may be sintered to produce a nickel silicide layer.
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