Package for mounting semiconductor device

United States of America Patent

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Dec 13, 2005
Grant Date
Jan 15, 2004
app pub date
Apr 10, 2003
filing date
Apr 10, 2002

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Abstract

A package for mounting a semiconductor device has a surface exposed to an atmosphere. The exposed surface is covered with a covering material such as a paint, a tape or a seal.

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Patent Owner(s)

LONGITUDE SEMICONDUCTOR S.A.R.L.;RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

[Classification Symbol]

[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Miyazawa, Toshio	Tokyo, JP	225	2711
Mouri, Morihiko	Tokyo, JP	1	0
Nakamura, Atsushi	Tokyo, JP	658	7354
Okuma, Sadayuki	Tokyo, JP	16	109
Ono, Takao	Tokyo, JP	33	382
Sakaguchi, Yosihiro	Tokyo, JP	1	0
Takahashi, Yasushi	Tokyo, JP	188	3800

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Package for mounting semiconductor device

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United States of America Patent

10409929

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PATENT NO	6975026
APP PUB NO	20040007383A1
SERIAL NO	10409929
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
December 13, 2005	US,6975026,B2 US6975026B2	GRANTED PATENT AS SECOND PUBLICATION
January 15, 2004	US,20040007383,A1 US20040007383A1	FIRST PUBLISHED PATENT APPLICATION

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10409929

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