Method of locally plating a part

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20040007471A1
SERIAL NO

10334788

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of locally plating an injection molded part includes delimiting two or more portions of the part by electrical insulation between the portions and successively plating each portion of the part by successively placing one or more electrodes on the surface of each portion. The insulation between the portions is obtained by dual injection molding of the part whereby a material that can be plated is injected to constitute the portions and a material that cannot be plated is injected to constitute a delimitation.

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Patent Owner(s)

Patent OwnerAddress
IPG ELECTRONICS 504 LIMITEDTRAFALGAR COURT LES BANQUES ST PETER PORT GY1 3DA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Phu, Marc US 7 52

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