Porous low-dielectric constant materials for use in electronic devices
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United States of America Patent
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app pub date -
Jan 27, 2003
filing date -
Nov 16, 1999
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Abandoned
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Abstract
A novel dielectric composition is provided that is useful in the manufacture of electronic devices such as integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by crosslinking a thermally decomposable porogen to a host polymer via a coupling agent, followed by heating to a temperature suitable to decompose the porogen. The porous materials that result have dielectric constants of less than 2.4.
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