Socket for semiconductor package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 29, 2004
app pub date -
Jan 23, 2003
filing date -
Jul 24, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A socket for semiconductor package in which most portion of a package side electrode portion of a contact pin has an inclined portion inclined at a predetermined angle with respect to a vertical direction, and when a land grid array package is received in a housing, a contact end of the package side electrode portion abuts on the land electrode within the area of the land electrode, and when the land grid array package is lowered, the contact end slides on the surface of the land electrode to remove foreign matters adhering to the land electrode to thereby put the contact end into contact with the land electrode at a good contact pressure.
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