Methods for fabricating three dimensional integrated circuits
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United States of America Patent
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Issued Date -
Jan 29, 2004
app pub date -
Oct 8, 2002
filing date -
Jul 8, 2002
priority date (Note) -
Abandoned
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Abstract
A method for forming a semiconductor device includes fabricating one or more digital circuits on a substrate; selectively fabricating either a memory circuit or a conductive pattern substantially above the digital circuits to control portion of digital circuits; and fabricating an interconnect and routing layer substantially above the digital circuits and memory circuits to connect digital circuits and one of the memory circuit or the conductive pattern.
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