One-pack moisture-curable epoxy resin composition
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United States of America Patent
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Issued Date -
Jan 29, 2004
app pub date -
Apr 4, 2003
filing date -
Dec 18, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A one-pack moisture-curable epoxy resin composition which includes: a carbonyl compound represented by the chemical formula (1) consisting of a carbonyl group and bonded thereto two C2-6 alkyl groups which are the same or different; a ketimine compound represented by the chemical formula (2) synthesized from an amine compound having at least one primary amino group per molecule; and an epoxy resin. The composition combines excellent curability with satisfactory storage stability. (1) R.sub.1: C2-6 alkyl R.sub.2: C2-6 alkyl (2) R.sub.3: organic group R.sub.4: C2-6 alkyl R.sub.5: C2-6 alkyl n: integer of 1 or larger 1
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