Method for forming of perforations in a substrate and device for carrying out said method
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United States of America Patent
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N/A
Issued Date -
Feb 5, 2004
app pub date -
Jun 16, 2003
filing date -
Apr 28, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The invention relates to a method for forming of perforations in a substrate, said perforations being formed by means of an intermittently operating plasmatron, the plasmatron forming an electrical discharge arc between a cathode and the substrate, and material being removed at the position where the arc strikes the substrate material, in the present case forming perforations. The invention also relates to a device for carrying out the method, in which an intermittently operating plasmatron and the substrate are moved relative to each other in order to form a pattern of perforations in the substrate.
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