Wafer prober
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Feb 5, 2004
app pub date -
Aug 27, 2003
filing date -
Jun 6, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An object of the present invention is to provide a wafer prober capable of protecting a chuck top conductor layer against noises, preventing integrated circuits and the like from erroneously operating due to the noises, and precisely determining whether or not the integrated circuits and the like normally operate. The present invention provides a wafer prober comprising: a ceramic substrate and a chuck top conductor layer formed on a main face of said ceramic substrate; and a guard electrode formed inside of said ceramic substrate, wherein a metal layer is formed on a side face of said ceramic substrate.
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