Molded resin for radiation shielding
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United States of America Patent
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Issued Date -
Feb 5, 2004
app pub date -
Jul 24, 2003
filing date -
Dec 1, 2000
priority date (Note) -
Abandoned
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Abstract
Providing a non-lead-based resin-molded product for radiation shield, as produced by melt molding a thermoplastic resin composition containing a polyamide resin and a tungsten powder in a plate form, where the tungsten powder characteristically contains tungsten metal at 95% by weight or more.
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