Method of manufacturing ultra-precise, self-assembled micro systems
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United States of America Patent
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Issued Date -
Feb 12, 2004
app pub date -
May 28, 2003
filing date -
Nov 28, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A technique for fabricating precisely machined micro devices and micro systems that facilitates the fabrication of three-dimensional device features and reduces the need for final micro assembly. The technique includes providing a layer of base material on which the micro device/system is to be formed. The base layer optionally undergoes mechanical micro machining such as ultra-precision milling, drilling, turning, or grinding, and/or non-mechanical micro machining including lithography and etching. Next, at least one layer of structural material is deposited on the micro-machined sacrificial layer. The structural layer then optionally undergoes mechanical and/or non-mechanical micro machining. Next, any excess material of the structural layer is removed. Finally, the material of the sacrificial layer is removed to at least partially free the final micro device/system from the base layer.
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