High performance system-on-chip passive device using post passivation process
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United States of America Patent
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May 12, 2009
Grant Date -
Feb 12, 2004
app pub date -
May 27, 2003
filing date -
Dec 21, 1998
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Abstract
A system and method for forming post passivation passive components, such as resistors and capacitors, is described. High quality electrical components, are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer.
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