Water soluble metal and semiconductor nanoparticle complexes
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United States of America Patent
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May 10, 2011
Grant Date -
Feb 19, 2004
app pub date -
Aug 15, 2002
filing date -
Aug 15, 2002
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Abstract
The invention provides a water soluble complex comprising an inner core of a metal or semi-conductor nanoparticle. The nanoparticle is coated with a hydrophobic ligand, which is encapsulated in a micelle. In an aqueous medium, the micelle comprises a hydrophilic shell and a hydrophobic core, the hydrophilic shell comprising a plurality of hydrophilic moieties, the hydrophobic core comprising a plurality of hydrophobic moieties, each hydrophobic moiety comprising at least one chain, each chain comprising a minimum of 8 atoms; wherein the total number of atoms in all chains for each moiety comprises at least 24 atoms. The micelle has a minimum average diameter of approximately 5 nm and a maximum average diameter of approximately 45 nm.
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