Process for removing contaminant from a surface and composition useful therefor
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United States of America Patent
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Apr 28, 2009
Grant Date -
Feb 26, 2004
app pub date -
Sep 2, 2003
filing date -
Jun 29, 2001
priority date (Note) -
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Abstract
Particulate and metal ion contamination is removed from a surface, such as a semiconductor wafer containing copper damascene or dual damascene features, employing a fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; and a hydroxycarboxylic acid and/or salt thereof or amine group containing acid.
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