Multi-layer antenna structure
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United States of America Patent
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N/A
Issued Date -
Feb 26, 2004
app pub date -
Mar 20, 2003
filing date -
Aug 22, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The invention provides a multi-layer antenna structure for use in a wireless communication system. The antenna may be integrated within a multi-layer circuit structure such as a multi-layer printed circuit board. The multi-layer antenna structure may include, for example, a radiating component and a conductive strip feed-line that electromagnetically couples to the radiating component to directly feed the radiating component. The conductive strip feed-line may be fabricated to form a balun. The conductive strip feed-line may, for example, form a quarter-wavelength open circuit in order to realize the balun. The balun may perform signal transformations, e.g., unbalanced to balanced, as well as impedance transformations. The radiating component and the conductive strip feed-line forming the balun may be formed on different layers of a multi-layer circuit structure.
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