Multilayer wiring board and method of manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Mar 4, 2004
app pub date -
Sep 3, 2002
filing date -
May 18, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A multilayer wiring board is manufactured wherein an intermediate wiring layer having a signal pattern is formed on an upper side of a lower shielding layer via an insulating layer, and an upper shielding layer is then formed on an upper side of the intermediate wiring layer via an insulating layer, by a method including forming the lower shielding layer having a lower shielding portion under a portion in which the signal pattern is to be formed, forming a lower metal wall erected from the lower shielding portion under both sides of the portion in which the signal pattern is to be formed, and forming the insulating layer for exposing the lower metal wall and covering the lower shielding layer.
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