Thermoelectric module and process for producing the same
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United States of America Patent
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N/A
Issued Date -
Mar 4, 2004
app pub date -
Jun 25, 2003
filing date -
Jun 26, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A thermoelectric module comprising support substrates, a plurality of wiring conductors formed on the opposing surfaces of the support substrates, a plurality of thermoelectric elements, and solder layers formed between said wiring conductors and said thermoelectric elements, wherein the total projected area (Sv) of voids contained in said solder layers projected onto the surfaces of the support substrates on the side where the solder layers are in contact via the wiring conductors is from 1 to 20% of the total area (St) of the surfaces on where the solder layers are in contact with the wiring conductors.
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