System and method for optimizing interconnections of memory devices in a multichip module

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United States of America Patent

PATENT NO 7836252
SERIAL NO

10232842

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Abstract

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An apparatus and method couples memory devices in a memory module to a memory hub on the module such that signals traveling from the hub to the devices have the same propagation time regardless of which device is involved. The hub receives memory signals from a controller over a high speed data link which the hub translates into electrical data, command and address signals. These signals are applied to the memory devices over busses having equivalent path lengths. The busses may also be used by the memory devices to apply data signals to the memory hub. Such data signals can be converted by the memory hub into memory signals and applied to the controller over the high speed data link. In one example, the memory hub is located in the center of the memory module.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ryan, Kevin J Eagle, US 106 3610

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